Rapid Thermal Processing
Zeus manufactures and supplies equipment for the front-end process (Clean, Etch, Strip) and the back-end process (Flux, Etch, Debond), focusing on single wafer cleaning devices and batch wafer cleaning devices used in the semiconductor manufacturing cleaning process. They supply rapid heat treatment equipment for silicon wafers.
As their exclusive distributor, we are trained to handle their products in-site installations and troubleshooting processes.
RHP200/150 Series
Rapid thermal processing system used for leading edge processes for memory or logic devices
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Temperature rang : 400 - 1350℃
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Temperature repeatability: ±1℃ (@ bare wafer)
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Temperature ramp up rate: 250℃/s (@ ATM process)
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Temperature cool down rate: 100℃/s
300mm Single Wafer Processor (12 Chamber)
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12-chamber triple decker
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Smaller footprint / higher throughput
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Minimized cleaning chamber design
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Individual exhaust control /high purity piping
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Uniform flow control
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Individual process in each of the 6 chambers
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Applications:
- Cleaning in FEOL or BEOL
- Post etch cleaning
- Pre cleaning
- Post cleaning
High Temperature 300mm Single Wafer Processor
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High temperature SPM process
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Fast PR stripping process time (≤ 30sec)
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Capable of processing wafers up to 240℃
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Less fume and less contamination
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Separate stripping and cleaning chambers
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ESG support solution – atomizer saves ≥80% of chemical compared to conventional system
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Applications
- PR strip
- Post CMP cleaning
- Post PLAD strip
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